We provide one-stop solutions including PCB fabrication, components procurement and PCB Assembly services. Owing to stringent manufacturing rules and regulations, increasing technological knowledge and enthusiasm to strive for the latest technologies, we have accumulated numerous capabilities to deal with different types of component packages such as BGA, PBGA, Flip chip, CSP and WLCSP.
BGA, short for ball grid array, is a form of SMT (Surface Mount Technology) package that is increasingly used in integrated circuits. BGA is beneficial to the improvement of solder joint reliability.
BGA exhibits the following advantages:
• Efficient application of PCB space - BGA package places connections beneath SMD (Surface Mount Device) package instead of around it so that space can be largely saved.
• Improvement in terms of thermal and electrical performance - Since BGA package helps to reduce inductance of power and ground planes and impedance controlled signal lines, heat can be moved away from pad, beneficial to heat dissipation.
• Increase of manufacturing yields - Owing to progress of solder reliability, BGA can maintain relatively large space between connections and high-quality soldering.
• Package thickness reduction - We specialize in handling fine pitch components assembly and up to now we can deal with BGAs whose minimum pitch can be as small as 0.35mm.
When you place a full turn-key PCB assembly order concerning BGA package, our engineers will, first of all, check your PCB files and BGA datasheet to summarize a thermal profile in which elements have to be taken into consideration such as BGA size, ball material etc. Prior to this step, we will check your PCB design for BGA and provide a Free DFM check to be aware of elements essential to PCB assembly including substrate material, surface finish, soldermask clearance, etc.
Due to attributes of BGA package, Automated Optical Inspection (AOI) fails to meet the inspection needs. We undertake BGA inspection by Automated X-ray Inspection (AXI) equipment capable of inspecting soldering defects at the early stage prior to volume manufacturing.